Electronic component mounting device
US10172268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Feb 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0406
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting device includes a mounting head that is movable in a horizontal direction and mounts a held component on a substrate and a control portion that controls the operation of the mounting head. The control portion is configured to perform control of a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate. A speed of mounting of the component is less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.