System and method for forming a bonded joint
US10173371B1 · kind B1 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Jul 5, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3085
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for forming a bonded joint on a composite structure is presented. An apparatus carrying a first workpiece is positioned relative to a second workpiece. A vacuum is applied to the first workpiece and a portion of the second workpiece. A bladder on a first surface of a housing of the apparatus is deflated. Deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece. The adhesive positioned between the first workpiece and the second workpiece is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.