Polymer films
US10173469B2 · kind B2 · utility
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15Claims
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Assignee
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Key dates
| Filing date | May 27, 2014 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | May 27, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2477/006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided a polymer film which includes: a base film layer including a polyamide-based resin having a particular relative viscosity and a copolymer including a polyamide-based segment and a polyether-based segment having a specific content; and an adhesive layer formed on at least one side of the base film layer, wherein a ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 0.65 to 1.2 at a shear rate of 1000 s−1 and a temperature of 260° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.