Bonding assembly
US10174778B2 · kind B2 · utility
2Cited by
113References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Feb 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/472
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.