Planarization of optical substrates

US10175391B2 · kind B2 · utility

Assignee

• Lawrence Livermore National Security, LLC · US

Inventors

• Christopher J. Stolz · Lathrop, US
• Jim Folta · Livermore, US
• Paul B. Mirkarimi · Sunol, US
• Regina Soufli · Berkeley, US
• Christopher C. Walton · Berkeley, US
• Justin Wolfe · Lawrenceville, US
• Carmen S. Menoni · Fort Collins, US
• Dinesh R. Patel · Sugar Land, US

Key dates

• Filing date: Jan 25, 2013
• Grant date: Jan 8, 2019
• Expiry date: May 21, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/265
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Planarization of defects in laser mirror and other optical component manufacture is disclosed. The planarization is performed by first depositing a relatively thick planarization layer, then carrying out a sequential deposition and etch process. The technique takes advantage of the non-uniform material removal rate as a function of etchant incident angle, and effectively buries the inclusion in a thick film with a near planar top surface. The process enables faster, more reliable manufacture of a non-defective high fluence multilayer mirror particularly suitable for high energy laser applications.