Patent · US Active

Wafer level lens system and method of fabricating the same

US10175462B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

Himax Technologies Limited · TW

Inventors

Yin-Dong Lu · Tainan, TW
Han-Ching Lin · Tainan, TW

Key dates

Filing date	Jul 23, 2015
Grant date	Jan 8, 2019
Priority date	—
Expiry date	Sep 2, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG02B3/0075
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A wafer level lens system includes a target lens and a wafer level lens group. The target lens includes a first surface, a second surface, and a first fitting structure. The second surface is opposite to the first surface. The first fitting structure is disposed at the second surface. The wafer level lens group includes a first transparent plate and a second fitting structure. The first transparent plate has a third surface and a fourth surface opposite to the third surface. The second fitting structure is disposed on the third surface. The first fitting structure is fitted into the second fitting structure, and there is a space encapsulated between the second surface and the third surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.