Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
US10175577B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2013 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Feb 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.