Power mapping and modeling system for integrated circuits
US10175705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Mar 2, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
This invention relates to a power mapping and modeling system for integrated circuits. An automated process includes determining a floor plan of the integrated circuit, dividing the integrated circuit into blocks based on the floor plan, pumping oil through an inlet valve, over the integrated circuit, and out an outlet valve to create a simulated oil-based cooling system, injecting a plurality of power pulses across the integrated circuit, applying infrared image techniques to the integrated circuit to create measured thermal images for the simulated oil-based cooling system, setting up a finite-element model (FEM) to estimate entries in a first thermal-to-power modeling matrix for the simulated oil-based cooling system, determining and storing performance monitoring counter (PMC) measurements related to power consumptions of the blocks of the integrated circuit, reconstructing a power dissipation for the simulated oil-based cooling system by using a thermal map for the simulated oil-based cooling system system, using the power dissipation of the simulated oil-based cooling system, the FEM, and the PMC measurements to create a thermal map for a copper based cooling system, and crea…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.