Shared cooling for thermally connected components in electronic devices
US10175731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component. The first heat generating electronic component, the second heat generating electronic component, another heat generating electronic component of the at least two heating generating electronic components, or any combination thereof is configured to compare the first measured temperature to a predetermined temperature, and decrease a power for the second heat generating electronic component based on the comparison.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.