Patent · US Active

Strip-type substrate for producing chip card modules

US10176420B2 · kind B2 · utility

0Cited by

5References

16Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Eckhard Ditzel · Gelnhausen, DE
Bernd Gehlert · Könnern, DE
Frank Krüger · Könnern, DE

Key dates

Filing date	Feb 17, 2016
Grant date	Jan 8, 2019
Priority date	—
Expiry date	Feb 19, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.