Low-noise, ultra-low temperature dissipative devices
US10176431B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 2, 2017 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Mar 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H7/24
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A dissipative device has a planar configuration with one or more resistor elements formed on an insulating substrate. Conductors are formed on the insulating substrate and are coupled to the resistor element(s) to transmit signals to/from the resistor element(s). The geometry of and materials for the dissipative device allow the conductors to act as heat sinks, which conduct heat generated in the resistor element(s) to the substrate (and on to a coupled housing) and cool hot electrons generated by the resistor element(s) via electron-phonon coupling. The dissipative device can be used in cooling a signal to a qubit, a cavity system of a quantum superconducting qubit, or any other cryogenic device sensitive to thermal noise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.