Method and system for completing point clouds using planar segments
US10176589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/10028
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems for completing missing points in a three-dimensional (3D) point cloud. The systems include a 3D sensor for measuring point data of objects in a scene, a processor in connection with the 3D sensor and a memory storing a program and the point data, and a display monitor connected to the processor and the 3D sensor for displaying a completed 3D point cloud, wherein the processor executes instruction steps of the program. The instruction steps include acquiring the point data of the objects to generate the 3D point cloud, wherein the point data include a set of points on the objects, extracting planar segments from the 3D point cloud, identifying connectivity relations and missing points among the planar segments, and filling the missing points in the 3D point cloud to generate the completed 3D point cloud using the planar segments and the connectivity relations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.