System and method for high throughput work-in-process buffer
US10177020B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 5, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G1/026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A buffer system for a semiconductor device fabrication tool includes one or more retractable shelves, one or more sliding assemblies positionable above the one or more load ports of the semiconductor device fabrication tool, and one or more lifting assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more sliding assemblies are configured to receive the sealable containers and are further configured to transport the sealable containers to one or more positions beneath the one or more retractable shelves. The one or more lifting assemblies are configured to transport the sealable containers between any two of the group including one or more retractable shelves, the one or more sliding assemblies, and the one or more load ports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.