Patent · US Active

Semiconductor apparatus and method of manufacturing the same

US10177127B2 · kind B2 · utility

4Cited by

15References

20Claims

0Family size

Assignee

HONG KONG BEIDA JADE BIRD DISPLAY LIMITED · CN

Inventors

Lei Zhang · Shanghai, CN
Qiming Li · Beijing, CN
Huiwen Xu · Shanghai, CN
Fang Ou · Monterey Park, US
Wing Cheung Chong · Tseung Kwan O, CN

Key dates

Filing date	Jan 27, 2016
Grant date	Jan 8, 2019
Priority date	—
Expiry date	Jan 27, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.