Optoelectronic component and method of producing an optoelectronic component

US10177293B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Michael Wittmann · Alteglofsheim, DE
• Tobias Gebuhr · Regensburg, DE
• David Racz · Regensburg, DE

Key dates

• Filing date: Nov 5, 2015
• Grant date: Jan 8, 2019
• Expiry date: Nov 5, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.