Glass powder blend, glass powder paste and photoelectric package
US10177338B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Oct 30, 2014 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/085
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.