PCB optical isolation by nonuniform catch pad stack
US10178764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.