Circuit board, manufacturing method thereof and display apparatus
US10178771B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2015 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The embodiments of present invention disclose a circuit board and a manufacturing method thereof and a display apparatus comprising the circuit board. The circuit board comprises a base substrate, a device to be soldered, a bonding pad and a support, wherein the bonding pad and the support are provided on the base substrate, and the device to be soldered is provided on the support and is connected with the bonding pad. By providing the device to be soldered on the support, the embodiments of present invention can effectively prevent the short circuit of the device to be soldered during the process of soldering and thus improve product yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.