Thermosyphon cooling apparatus with isolation of cooled components
US10178803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D8/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes at least one evaporator having a surface configured for mounting of a power electronic device thereon, a condenser fluidically coupled to the at least one evaporator by at least two coolant conduits that electrically insulate the at least one evaporator from the condenser, and a dielectric coolant contained in a thermosyphon loop comprising the at least one evaporator, the condenser and the at least two coolant conduits. The at least one evaporator may include at least two evaporators fluidically coupled by at least one coupler that electrically insulates the at least two evaporators from one another. The at least one evaporator may be housed within an enclosure, and the condenser may be positioned within the enclosure or outside of the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.