Transfer head array
US10179731B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2015 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Mar 24, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C99/002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A transfer head array includes a base substrate, an interlayer isolation layer, plural transfer heads, and at least one shielding layer. The interlayer isolation layer is disposed on the base substrate, and the interlayer isolation layer has a flat top surface facing away from the base substrate. The transfer heads are arranged on the interlayer isolation layer. The shielding layer is disposed in the interlayer isolation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.