High-conductivity bonding of metal nanowire arrays
US10180288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2017 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83238
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.