Patent · US Active

Systems and methods of testing multiple dies

US10180454B2 · kind B2 · utility

1Cited by

1References

28Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Rubin Ajit Parekhji · Bengaluru, IN
Mahesh M. Mehendale · Bengaluru, IN
Vinod Menezes · Bengaluru, IN
Vipul Kumar Singhal · Kanchinakote, IN

Key dates

Filing date	Apr 15, 2016
Grant date	Jan 15, 2019
Priority date	—
Expiry date	Dec 12, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/318511
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method of testing a semiconductor wafer comprising a scribe line and a plurality of dies. The method includes implementing a first landing pad on the scribe line and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the plurality of dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip and applying an ATE resource to the first cluster of dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.