Patent · US Active

Adjustable cooling for electronic devices

US10180710B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Yanbing Sun · Shanghai, CN
Yongkang Wu · Nanjing, CN
Jeff King · Markleville, US
Peifeng Si · Shanghai, CN

Key dates

Filing date	Aug 11, 2014
Grant date	Jan 15, 2019
Priority date	—
Expiry date	Aug 19, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG06F1/20
WIPO fieldTransport
WIPO sectorMechanical engineering

Abstract

Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.