Photoconductive switch package configurations having a profiled resistive element
US10181544B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2016 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Oct 2, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4295
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.