Light emitting device, package, and method for manufacturing these

US10181552B2 · kind B2 · utility

Assignee

• NICHIA CORPORATION · JP

Inventors

• Koji Abe · Nagoya, JP
• Tomohisa Kishimoto · Anan, JP

Key dates

• Filing date: Apr 15, 2016
• Grant date: Jan 15, 2019
• Expiry date: Jul 25, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.