Alloy bonded graphene sheets for enhanced thermal spreaders
US10182493B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Jun 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.