Conduction cooled module
US10182515B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2014 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Apr 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.