Method for providing a lamination film with adhesive, method for applying hot melt, application, lamination plant and method for upgrading such a plant
US10183474B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Dec 21, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for providing a laminate film with adhesive as a step in the preparatory process for manufacturing a laminate mold part using a support part, a method for applying a hot melt to a laminate film, a method for manufacturing a laminate mold part, using a method, a system for laminating a support part as well as a method for such a system produces especially high quality lamination and even if the support part, where the laminate film should be laminated, is not porous by applying the adhesive to the support part for bonding the macroscopically structured laminate film, so that there is a duct system. The air can flow through the duct system between the laminate film and the support part during the lamination process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.