Method for supplying deposition material, method for producing substrate, control device and deposition device
US10184169B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2012 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Feb 1, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/543
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a method for supplying a deposition material including a heating step of heating and evaporating a deposition material accommodated in a material accommodating section in which the deposition material is accommodated, a supply step of supplying the deposition material into the material accommodating section by feeding and melting a deposition material in a solid phase toward the melted deposition material in the material accommodating section, and a melted state detection step of detecting a melted state of the deposition material in the solid phase after supply in the supply step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.