Method for generating plasma uniformly on dielectric material
US10184181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2015 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2465
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for checking a discharge inception voltage of a dielectric material, a method for forming a displacement field on the dielectric materials comprising applying a voltage the same as or higher than the discharge inception voltage generated by an external field obtained from the above to the dielectric material to which electrodes are connected, a method for forming plasma on the surfaces of the dielectric material comprising injecting reaction gases and applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, a method for forming a displacement field on the entire surface of the dielectric material comprising applying a voltage the same as or higher than the discharge inception voltage obtained above to the dielectric material to which electrodes are connected, and a dielectric material which is modified, in which the surfaces thereof are treated with plasma by the methods described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.