Optical fingerprint sensor package
US10185866B2 · kind B2 · utility
4Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Sep 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.