Heat sink for cooling of power semiconductor modules
US10186470B2 · kind B2 · utility
3Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.