Semiconductor package with grounded fence to inhibit dendrites of die-attach materials
US10186476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a semiconductor package with at least one grounded fence to inhibit dendrites of die-attach materials. The semiconductor package includes a carrier, a die-attach material, and a wire-bonded die. The carrier includes a die pad and a negative carrier contact. The wire-bonded die includes a die body, a negative die contact, a grounded fence, and a bonding wire. A bottom surface of the die body is coupled to the die pad by the die-attach material. The negative die contact and the grounded fence reside over a top surface of the die body. The grounded fence, which has a same DC potential as the die pad, extends between the negative die contact and a periphery of the top surface of the die body. The bonding wire extends from the negative die contact to the negative carrier contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.