Wiring board and method of manufacturing wiring board
US10187971B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 16, 2013 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Sep 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board that includes: insulation layers and wiring layers which are laminated alternately; a component connection pad present on one surface of the wiring board in a lamination direction of the insulation layers and the wiring layers, and to which an electronic component is connected; a circuit connection pad present on another surface of the wiring board in the lamination direction and is connected to a circuit board; and a structure which includes a coaxial structure, wherein each of the wiring layers is connected by a via, and the coaxial structure includes an inner wiring part extending in the lamination direction and an outer wiring part located on a side corresponding to an outer peripheral surface of the inner wiring part through an insulating resin, and the inner wiring part is electrically connected to the component connection pad and the circuit connection pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.