Head mounted computing device, adhesive joint system and method
US10187977B2 · kind B2 · utility
0Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Jun 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.