Circuit board and method for making the same
US10187984B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Nov 20, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.