Repair apparatus and method for composite panels having a conductive layer
US10189235B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Sep 15, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A repair apparatus for an electrically conductive layer of a composite structure includes a dielectric layer, having a perimeter, secured to the composite structure, a first adhesive layer, and a conductive layer, secured over the dielectric layer and to the composite structure via the first adhesive layer around an entirety of the perimeter of the dielectric layer, the first adhesive layer being scored along a perimeter region thereof to improve a conductive path between the conductive layer and the composite structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.