Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
US10189243B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 28, 2016 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jul 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.