Method for self-aligning solder-attached MEMS die to a mounting surface
US10189706B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Aug 25, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/055
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.