Patent · US Active

Organosilicon modified photoinitiator and a photo-curable adhesive composition comprising the same

US10189867B2 · kind B2 · utility

0Cited by

19References

20Claims

0Family size

Assignees

HENKEL IP & HOLDING GMBH · DE
Henkel AG & Co. KGaA · DE

Inventors

Hao Wu · Shandong, CN
Zhiming Li · Shanghai, CN
Jinyou Li · Shanghai, CN
Yong Zhang · Jacksonville, US
Xingang Zhang · Beijing, CN
Zhixiang Lu · East Lyme, US
Zheng Lu · Kingwood, US

Key dates

Filing date	Feb 27, 2017
Grant date	Jan 29, 2019
Priority date	—
Expiry date	Feb 27, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2433/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present document discloses an organosilicon modified photoinitiator represented by the general formula (I): wherein,

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.