Epoxy two-part formulations
US10190028B2 · kind B2 · utility
1Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jul 26, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J11/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.