Lamp assembly for use in a headlamp
US10190745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Apr 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lamp assembly for mounting in a headlamp comprising a heat sink having a printed circuit board landing area for receiving a printed circuit board and a light source landing area for receiving at least one light source. The lamp assembly also comprises a light guide and a bracket for detachably mounting on the heat sink. The bracket is adapted to engage and secure the light guide in a predetermined position on the heat sink, the at least one light source and the printed circuit board a unsealed in the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.