Optical devices and methods of making same
US10190908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2018 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F55/255
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.