Waveguide fabrication method
US10191215B2 · kind B2 · utility
8Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2016 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | May 4, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/56
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A waveguide fabrication method including the steps of providing a substrate including at least one waveguide recess structure and a stress release recess structure for receiving a waveguide material, and depositing the waveguide material onto the substrate and into both the waveguide recess structure and the stress release recess structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.