Hub-link liquid cooling system
US10191521B2 · kind B2 · utility
3Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for computer systems includes one or more cooling hubs and one or more heat spreading devices. The heat spreading devices have nodes and paths defining inner pathways that enclose a two-phase working fluid. The nodes and paths network acts as links for the two-phase working fluid to absorb and transfer thermal energy from the heat-generating components of the electronic device to the cooling hub. The hub-link structure decouples the direct geometrical relationship between heating components and cooling sources to enable a higher degree of design freedom, space management, and cooling redundancy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.