Board production work method, board imaging conditions determination method, and board production work device
US10192300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2013 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board production work method which includes a position detection process which detects an arrangement position of a detection target provided on a printed circuit board, and a work executing process which subjects the printed circuit board to predetermined production work based on the detected arrangement position, in which the position detection process includes an image acquisition step of imaging the printed circuit board under multiple imaging conditions and acquiring multiple items of original image data containing luminance values of each pixel arranged in two-dimensional coordinates, a difference calculation step of using two of the multiple items of original image data as calculation targets, calculating differences between luminance values of pixels with same coordinate values, and acquiring difference image data which is formed of luminance difference values of each of the pixels, and a position determination step of determining the arrangement position based on the difference image data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.