Rapid cooling system for a bond head heater
US10192847B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Oct 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75502
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.