Systems and methods for scalable perovskite device fabrication
US10193092B2 · kind B2 · utility
1Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jan 24, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Continuous processes for fabricating a perovskite device are described that include forming a perovskite layer or film on a substrate using a linear deposition device, and optionally using a conductive tape lamination process to form an anode or a cathode layer on the perovskite device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.