Light emitting device manufacturing method and apparatus thereof
US10193098B2 · kind B2 · utility
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31Claims
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Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jun 1, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
A method of manufacturing a light emitting device includes providing a substrate and forming a plurality of photosensitive bumps over the substrate. The method also includes forming a photosensitive layer over the plurality of photosensitive bumps and patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface. The method also includes disposing an organic emissive layer on the surface, and removing the patterned photosensitive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.