Composite material, high-frequency circuit baseboard made therefrom and production method thereof
US10194528B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2011 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jun 6, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two properties sides thereof. The baseboard uses a porous ePTFE film with excellent dielectric as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard. The dielectric constant of the high-frequency circuit baseboard and prepreg is isotropic in both X and Y directions. The thickness of the prepreg can be regulated by employing porous ePTFE films with a different thickness, which avoids cracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.